SEI Laser PAPER BLASTER 02SEI Laser
PAPER BLASTER 02
SEI Laser PAPER BLASTER 02
SEI Laser
PAPER BLASTER 02
Năm sản xuất
2008
Tình trạng
Đã qua sử dụng
Vị trí
Ba Lan 

Dữ liệu cơ bản
- Tên máy:
- SEI Laser PAPER BLASTER 02
- Nhà sản xuất:
- SEI Laser
- Mô hình:
- PAPER BLASTER 02
- Năm sản xuất:
- 2008
- Tình trạng:
- sẵn sàng sử dụng (đã qua sử dụng)
Giá & Vị trí
- Vị trí:
- , Ba Lan

Gọi điện
Chi tiết kỹ thuật
Laser
Công suất laser:
115.000 W
Thông tin chi tiết
Số lượng trục:
3
Chi tiết về đề nghị
- ID tin đăng:
- A22840980
- Số tham chiếu:
- PL-CUT-SEI-2008-00001
- Cập nhật:
- lần cuối vào ngày 29.09.2026
Mô tả
CO2 laser cutting machine manufactured in 2008. This SEI Laser Paper Blaster 02 features a sealed CO₂ laser with a nominal power of 115 W, designed for paper and cardboard processing. It includes an automatic sheet feeder with a maximum stack height of 350 mm and an integrated conveyor system for efficient operation. If you are looking to get high-quality cutting, marking, and engraving capabilities, consider the SEI Laser Paper Blaster 02 machine we have for sale. Contact us for further details.
Laser system
• Wavelength: ~10.6 µm
• Scanning head: 3-axis galvanometric system
• Axes: X/Y via scanning mirrors; Z with dynamic focusing (per optical setup)
• Working field: Approx. 200 × 200 to 500 × 500 mm
• Processing modes: Cutting, marking, engraving, micro-perforation
• Adjustable parameters: Laser power, frequency, processing speedPaper handling
• Feeding: Automatic sheet feeder with stack loader
• Max stack height: 350 mm
• Paper weight range: 120–300 g/m²
• Operation: Fully automatic cycle
• Transport: Integrated conveyor system
• Output: Automatic sheet discharge and collectionControl and software
• Control: PC-basedSafety and extraction
• Enclosed laser processing area
• Interlocked access doors
• Laser safety shutters
• Emergency-stop devices
• Fume extraction connections (external unit required)Electrical data
• Supply voltage: 230 V AC, single phase with neutral and PE
• Frequency: 50/60 Hz
• Machine nameplate power: 200 W
• Machine nameplate current: 1 A
Pgedpfxez Hbyyj Acwot
Laser system
• Wavelength: ~10.6 µm
• Scanning head: 3-axis galvanometric system
• Axes: X/Y via scanning mirrors; Z with dynamic focusing (per optical setup)
• Working field: Approx. 200 × 200 to 500 × 500 mm
• Processing modes: Cutting, marking, engraving, micro-perforation
• Adjustable parameters: Laser power, frequency, processing speedPaper handling
• Feeding: Automatic sheet feeder with stack loader
• Max stack height: 350 mm
• Paper weight range: 120–300 g/m²
• Operation: Fully automatic cycle
• Transport: Integrated conveyor system
• Output: Automatic sheet discharge and collectionControl and software
• Control: PC-basedSafety and extraction
• Enclosed laser processing area
• Interlocked access doors
• Laser safety shutters
• Emergency-stop devices
• Fume extraction connections (external unit required)Electrical data
• Supply voltage: 230 V AC, single phase with neutral and PE
• Frequency: 50/60 Hz
• Machine nameplate power: 200 W
• Machine nameplate current: 1 A
Pgedpfxez Hbyyj Acwot
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